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The Ceramic Interconnect Initiative

25 October 1999

ADVISORY/The Ceramic Interconnect Initiative (CII); Roundtable Discussion Wednesday Oct. 27

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WHAT:  Recent findings regarding potential health hazards
       associated with wireless technology have been
       top-of-mind for consumers. This week, experts in the
       field of ceramic technology - the technology
       supporting many wireless communication devices- will
       meet in a round-table to discuss recent developments
       and trends, as well as future plans for ceramic
       technology.

WHO:   The Ceramic Interconnect Initiative (CII) of the 
       International Microelectronics and Packaging Society
       (IMAPS)

       The Ceramic Interconnect Initiative is dedicated to 
       increasing the awareness of the benefits of ceramic 
       technology among OEM designers.

WHEN:  October 27, 1999, noon-1:30 p.m.
       To be held during Window to the 21st Century in
       Microelectronics, IMAPS 32nd International Symposium
       on Microelectronics

WHERE: Chicago Hilton & Towers
       Room 5H
       720 S. Michigan Avenue
       312/922-4400

DETAILS: From cell phones to anti-lock brakes, use of
         wireless communications is exploding, and ceramic is
         particularly beneficial in these applications.
         Today, ceramic is the technology of choice for a
         whole new generation of designers of implantable
         medical devices. At the round-table, designers will
         discuss the benefits of ceramic technology to
         support wireless products, issues they face and
         their plans for implementations of the future.